发明名称 PATTERN FORMING METHOD
摘要 PURPOSE:To simplify manufacturing process and to enhance throughput by patternwise exposing the material to be treated to light, X-rays, ion beams, or electron beams and selectively graft copolymerizing the exposed parts under an atmosphere of 2 kinds of monomer vapors to deposit a graft copolymer film. CONSTITUTION:A resist 2 formed on a substrate 1 is patternwise exposed for example, with X-rays 4, and selectively graft copolymerized on the exposed parts 5 under the atmosphere of at least 2 kinds of the monomer vapors 6, 7 which can increase graft reactivity with the resist 2, thus permitting the graft copolymer film 8 in a form of a desired pattern to be sufficiently deposited with a small quantity of radiation for a short reaction time, and a single layer resist process to be adopted, and consequently, the resist process to be simplified and throughput to be enhanced.
申请公布号 JPS6442648(A) 申请公布日期 1989.02.14
申请号 JP19870198072 申请日期 1987.08.10
申请人 HITACHI LTD 发明人 OIIZUMI HIROAKI;MOCHIJI KOZO;HAYATA YASUNARI;KIMURA TAKESHI
分类号 G03F7/36;G03F7/00;G03F7/20;G03F7/38;H01L21/027;H01L21/30 主分类号 G03F7/36
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