发明名称 WIRE BONDING EQUIPMENT
摘要 PURPOSE:To keep a wire unoxidized and to conduct highly reliable wire bonding with good reproducibility by preparing unoxidation atmosphere for the gas atmosphere of a spool container which contains a spool by feeding inert gas. CONSTITUTION:Inert gas is fed for the gas atmosphere of a spool container 24 to prevent oxidization of a wire 8 which is wound to a spool 20 in wire bonding equipment. Due to the unoxidized atmosphere of the spool container 24, a wire is kept unoxidized independent of operating frequency of wire bonding equipment or consumption speed of a wire. Therefore, a ball formed at the tip of a wire is usually spheral, and yet soft thus not causing chip damage.
申请公布号 JPS6441233(A) 申请公布日期 1989.02.13
申请号 JP19870196198 申请日期 1987.08.07
申请人 HITACHI LTD 发明人 IIZAKA SUSUMU;NAKAJIMA MAKOTO
分类号 H01L21/60 主分类号 H01L21/60
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