| 摘要 |
PURPOSE:To prevent a junction from peeling-off or cracks by a method wherein strain in presence between a substrate and a chip is effectively absorbed by a wire section retained on a ball in a process employing a wire bonder to deliver a bump electrode. CONSTITUTION:The end of a wire section 5a of an alloy wire 5 is heated for the formation of a ball section 7, the alloy wire 5 is pulled with the ball section 7 bonded to a semiconductor material 3, and the ball section 7 is delivered upward with the wire section 5a retained thereon. Similar ball sections 7 are provided in plurality, the top ends 5a' of wire sections 5a are disconnected to unify the length, ball sections 7' deliverd to the other part of the surface of the semiconductor material 3 are connected to the upper ends of the wire sections 5a for the formation of bump electrodes 7a and, through the intermediary of the bump electrode 7a, wirings 2 and the semiconductor material 3 are connected. In this design, the wire sections 5a absorbs stress attributable to the difference in thermal expansion coefficient between the substrate 1 and the semiconductor material 3, preventing a junction between the bump electrodes 7a and the wirings 2 or electrodes 3a from peeling-off or cracks. |
