| 摘要 |
PURPOSE:To simplify a wire-connecting process by a method wherein an element selected out of Pb, Sn, and In is employed as the main element to constitute a semiconductor device main body and is connected to a lead through the intermediary of a bump electrode originating in a fine alloy wire formed in a quench coagulation process. CONSTITUTION:An alloy wire 5 is composed mainly of an element selected out of Pb, Sn, and In, and is a fine wire fabricated by a quench coagulation method. The alloy wire 5 is inserted into a wire bonder capillary 4. The capillary 4 is pulled up with a ball 7, formed at the end of the alloy wire 5 by the heat supplied by an electric torch 6, kept in contact with a wire 2. This results in a bump electrode 7a, which is the ball 7 separated from the alloy wire 5. A process follows wherein the bump electrode 7a is attached to an electrode 3a positioned on a semiconductor substrate 3, which establishes electrical connection between the wire 2 and the electrode 3a and installs the semiconductor chip 3. In this way, the manufacturing process may be simplified. |
