发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PURPOSE:To conserve manual movement of a material between steps, to decrease the number of times of the evacuations and formations of atmosphere and to shorten a pattern forming time, by providing a mask forming part, a dry etching part and a mechanism for conveying a semiconductor substrate between both parts in the main body of an apparatus, in which a vacuum atmosphere is formed. CONSTITUTION:Light is projected on a resist film on a semiconductor substrate 101 and a mask having a specified pattern is formed in a mask forming part U1. The semiconductor substrate 101 is dry-etched through the mask, which is formed on the semiconductor substrate 101 with the mask forming part U1, in a dry etching part U2. A conveying mechanism conveys the semiconductor substrate 101 between the mask forming part U1 and the dry etching part U2. These parts and mechanism are provided in the main body of an apparatus, in which a vacuum atmosphere is formed. For example, the mask forming part U1 is composed of a light source 108, a reflecting mirror 109, a quartz window 103, an IC mask 102 and a reducing lens 105. The dry etching part U2 is composed of a lower electrode 106 and an upper electrode 107. The lower electrode 106 is provided at the bottom part of a reaction chamber 104 so that the electrode can be rotated. The lower electrode 106 is used as the mounting electrode and the conveying mechanism for the semiconductor substrate 101.
申请公布号 JPS6433928(A) 申请公布日期 1989.02.03
申请号 JP19870189731 申请日期 1987.07.29
申请人 NEC CORP 发明人 AKIYAMA TAKAO;SAKAMOTO MITSURU
分类号 H01L21/30;H01L21/027;H01L21/302;H01L21/3065 主分类号 H01L21/30
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