| 摘要 |
<p>PURPOSE:To prevent short circuits between terminals, by appropriately changing bonding positions on the side of a lead frame, performing wire bonding, molding the terminal part of the lead frame, thereby broadening the interval between the neighboring terminals in a threedimensional pattern. CONSTITUTION:A bonding pad 14, which is formed on a semiconductor substrate, is bonded to a bonding terminal 22 of a lead frame, and a semiconductor device is assembled. At this time, the bonding position on the side of the lead frame is appropriately changed, and the bonding is performed. After the bonding is finished, the bonding terminal 22 of the lead frame is molded. For example, the semiconductor device 21 is mounted on a main body 24 of the lead frame. The semiconductor device 21 and the bonding terminal part 22 of the lead frame are connected by using a bonding wire 23. Then, the bonding terminal parts 22 of the lead frame are molded by using a metal mold so as to form a zigzag pattern. Not only the molding of the bonding terminal parts of the lead frame but also the bonding positions are selected appropriately.</p> |
