| 摘要 |
<p>PURPOSE:To eliminate the need for the protective sheathing of an impedance material film, and to decrease sheathing processes by irradiating the material film with laser beams through a base member and spirally removing the material film so that specified impedance is obtained. CONSTITUTION:A resistance material film 12 composed of Ni-P is formed extending over external side faces near both ends of a base member 11 through both end faces from the inwall surface of the member 11. Laser beams 13 are applied through the member 11. Beams 13 are moved in the direction shown by the arrow A in the axial direction of the member 11 at that time while the member 11 is turned around a shaft for the member 11. Consequently, a spiral removing section 12a is shaped to the material film 12 so that the resistance material film 12 is brought to a specified resistance value between both ends of the member 11. Both end sections of the member 11 are capped with cap terminals 14. Accordingly, the protective sheathing of the material film 12 is unnecessitated, thus decreasing sheathing processes.</p> |
