发明名称 RESIN SEALING APPARATUS FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a resin burr from generating at a lead frame on a chase block by forming a plurality of slit grooves having specific structure opening in a direction perpendicular to the pressurizing direction to the spacer block. CONSTITUTION:A plurality of slit grooves 24 opening in a direction perpendicular to a pressurizing direction are formed on a spacer block 23, two adjacent grooves 24 of the grooves 24 are positioned on the inner and outer peripheral surfaces of the block 23, and the depth size is set to the size elastically deformable in a pressurizing direction of the block 23. Accordingly, the block 23 is elastically compressed or deformed in a pressurizing direction together with a supporting pin 9 to prevent upper and lower chase blocks 21 from deforming. Therefore, the parting faces 21a of both the chase blocks 21 can be contacted each other at the time of clamping, pressing forces are uniformly acted, thereby effectively preventing a resin burr from generating at the lead frame on the chase block.
申请公布号 JPS6431428(A) 申请公布日期 1989.02.01
申请号 JP19870187320 申请日期 1987.07.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUEZAKI HIDEAKI;YAMADA HIROMICHI;TANAKA SUEKICHI;MORITA YUTAKA;TSUTSUMI KOJI
分类号 B29C45/02;B29C45/17;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
代理机构 代理人
主权项
地址