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发明名称
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
摘要
申请公布号
US4801999(A)
申请公布日期
1989.01.31
申请号
US19870073557
申请日期
1987.07.15
申请人
ADVANCED MICRO DEVICES, INC.
发明人
HAYWARD, JAMES;BROWN, CANDICE H.
分类号
H01L23/50;H01L21/60;H01L23/495;(IPC1-7):H01L23/48;H01L23/12
主分类号
H01L23/50
代理机构
代理人
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