| 摘要 |
<p>PURPOSE:To enable the assembling in an assembling line, by using a lead frame which connects with a retaining plate to fix a laser diode chip, and has a photodetector retaining plate to fix a photodetector, said photodetector retaining plate being possible to be freely bent. CONSTITUTION:A lead frame 7 is provided with a photodetector retaining plate 12 which is possible to be freely bent against a retaining plate 7. A laser diode chip 11 is fixed on the retaining plate 7, and a photodetector 14 is fixed on a photodetector retaining plate 12. Electrodes of the chip 11 and the photodetector 14 and specified leads 3, 4 are electrically connected with wires 15, 16. The photodetector retaining plate 12 is raised at a linking part to the retaining plate 7, in order that a light receiving surface of the photodetector 14 may receive the laser light emitted from the chip 11. Then the chip 11, the photodetector, etc., are subjected to packaging with transparent resin.</p> |
