发明名称 Electronic module interconnection system.
摘要 <p>A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The system eliminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.</p>
申请公布号 EP0300717(A2) 申请公布日期 1989.01.25
申请号 EP19880306557 申请日期 1988.07.18
申请人 TANDEM COMPUTERS INCORPORATED 发明人 FERCHAU, JOERG U.;DIAZ, RANDALL J.;PHAM, HOA
分类号 H01R12/16;G06F1/16;G06F1/18;G06F1/20;G11B33/12;H05K7/14;H05K7/20 主分类号 H01R12/16
代理机构 代理人
主权项
地址