发明名称 |
Support assembly for integrated circuits |
摘要 |
A composite support assembly for an integrated circuit chip includes a rigid lead frame that is attached to a relatively thin flexible tape-like structure. The tape-like structure is etched with inner lead fingers and outer lead fingers to allow a short pitch, high density arrangement of the lead fingers, thereby enabling bond wires that connect an IC chip to the support assembly to be shortened. As a result, a significant increase in the number of leads is realized, using a standard size IC package.
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申请公布号 |
US4800419(A) |
申请公布日期 |
1989.01.24 |
申请号 |
US19870008208 |
申请日期 |
1987.01.28 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
LONG, JON;SAHAKIAN, V. K. |
分类号 |
H01L21/60;H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L23/28 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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