MANAGEMENT OF PROCESS, ESPECIALLY PRIMARY COOLING WATER FOR PRESSURIZED WATER TYPE NUCLEAR REACTOR AND APPARATUS THEREFOR,申请号JP19870177052-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MANAGEMENT OF PROCESS, ESPECIALLY PRIMARY COOLING WATER FOR PRESSURIZED WATER TYPE NUCLEAR REACTOR AND APPARATUS THEREFOR
摘要
申请公布号	JPS6421344(A)	申请公布日期	1989.01.24
申请号	JP19870177052	申请日期	1987.07.17
申请人	CENTRAL RES INST OF ELECTRIC POWER IND;NIKKISO CO LTD	发明人	NAKAOKA AKIRA;IRITANI YUICHI;OSADA FUMIO;WATANABE HIROYUKI;MINAMI TOSHITAKA;NAKAO KATSUHISA
分类号	G01N27/06;G21C17/02	主分类号	G01N27/06
代理机构		代理人
主权项
地址

您可能感兴趣的专利

提升压电高分子电性输出方法及压电／导电混合高分子薄膜制程;METHOD OF ENHANCING ELECTRIC OUTPUT OF PIEZOELECTRIC POLYMER AND FABRICATION PROCESS OF PIEZOELECTRIC/CONDUCTIVE POLYMER HYBRID THIN FILM

非可见光发射装置;INVISIBLE LIGHT EMITTING DEVICE

发光二极体;LED

光半导体装置之制造方法及光半导体装置;METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE

发光二极体封装方法;METHOD OF MANUFACTURING LIGHT EMITTING DIODES

发光二极体封装结构及其制造方法;LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

绝缘闸极型半导体装置的制造方法及绝缘闸极型半导体装置

半导体基板及其制法;SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF

集成堆叠式多晶片的半导体器件及其制备方法;SEMICONDUCTOR DEVICE WITH STACKED MOSFETS AND METHOD OF MANUFACTURE

具有电磁干扰屏蔽层的半导体封装、制造其之方法、包含其之电子系统及包含其之记忆卡;SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING LAYERS, MTTHODS OF FABRICATING THE SAME, ELECTRONIC SYSTMES INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME

半导体装置及其制法;SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

散热器;HEATSINK

晶粒检测方法;WAFER DIE INSPECTION METHOD

导电封装结构及其制造方法;CONDUCTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

用于控制层叠晶片的位置之技术;TECHNIQUE FOR CONTROLLING POSITIONS OF STACKED DIES

半导体装置之制造方法;METHOD OF FABRICATING SEMICONDUCTOR DEVICE

使用处理系统之气隙结构整合;AIR GAP STRUCTURE INTEGRATION USING A PROCESSING SYSTEM

清洗方法及基板处理装置;CLEANING METHOD AND SUBSTRATE PROCESSING DEVICE

电子零件制造用之切断装置及切断方法

处理方法;METHOD FOR TREATMENT