发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To form a sputtering device equipped with a target having superior thermal conductivity and cooling efficiency, by providing recessed and projecting parts having cooling-water passages to the joining plane between a target and a backing plate and by binding the above target and backing plate together by a mechanical means. CONSTITUTION:Recessed and projecting parts 1a, 2a (about 30mm width and about 5mm height) having mutually meshing shapes are formed at the respective planes of a target 1 and a backing plate 2 facing each other. Further, cooling- water passages 2c (about 15mm depth and about 3mm height) are provided, besides conventional cooling-water passages 2b, to the recessed and projecting parts 2a of the backing plate 2. Subsequently, the recessed and projecting parts 1a of the target 1 are engaged with the recessed and projecting parts 2a of the backing plate 2, and they are fixed with bolts 3 into an integral structure. By this method, the sputtering device equipped with the target 1 having superior thermal conductivity and excellent in cooling efficiency can be obtained.
申请公布号 JPS6417862(A) 申请公布日期 1989.01.20
申请号 JP19870173568 申请日期 1987.07.10
申请人 FUJITSU LTD 发明人 IWAMA RYUJI
分类号 C23C14/34 主分类号 C23C14/34
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