发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To remove the photocured part by finely dividing said part, by incorporating a specified ethylenic unsatd. compd. in the titled composition contg. a polymer capable of supplying a film forming property which has a carboxylic group, a photopolymerization initiator and/or a photopolymerization initiator precursor. CONSTITUTION:The titled composition contains 20-90pts.wt. of the compd. shown by formula I, 10-80pts.wt. of said polymer contg. the carboxyl group, 0.1-10pts.wt. of an org. halogen compd., and 0.1-10pts.wt. of the photopolymerization initiator or its precursor based on 100pts.wt. of the titled composition. In formula I, (n) is an integer of 1-23, R1-R3 are each hydrogen atom. or methyl group. As the titled composition is removed by finely dividing in an alkaline aqueous solution, the peeling piece of the titled composition is easily removed, without twisting around the peeling roll of an automatic peeling machine usable for a manufacturing step of a print circuit board, thereby remarkably improving the workability of the titled composition.
申请公布号 JPS6410235(A) 申请公布日期 1989.01.13
申请号 JP19870165866 申请日期 1987.07.02
申请人 HITACHI CHEM CO LTD 发明人 TANAKA YOJI;MASAOKA KAZUTAKA;KAKUMARU HAJIME;MAKINO DAISUKE
分类号 G03C1/00;C08F20/10;C08F220/20;C08F290/00;C08F299/00;G03F7/027;G03F7/029;G03F7/033;G03F7/32 主分类号 G03C1/00
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