| 摘要 |
PURPOSE:To wire in high density and to obtain a multiwiring substrate having excellent insulation at high temperatures by using a composition containing epoxy resin having specific ratio of epoxy resin including 5000 or more of molecular weight and epoxy resin including 5000 or less of molecular weight as an adhesive coating film for bonding insulated wire to an insulating substrate, alkylation melamine resin, saturated polyester resin, and crosslinking agent. CONSTITUTION:In a manufacture of a circuit board for forming a desired wiring pattern by forming an adhesive coating film on an insulating substrate, laying insulated wire on the film and simultaneously bonding it, a composition containing (a) epoxy resin having 5000 or more of molecular weight, (b) 100 parts of epoxy resin having 10:90-90:10 of epoxy resin having 5000 or less of molecular weight as the adhesive coating film, (c) 2-80 parts of alkylation melamine resin, (d) 5-50 parts of saturated polyester resin, and (e) 0.1-50 parts of crosslinking catalyst. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved. |
