| 摘要 |
1. A process for manufacturing a semiconductor device comprising, on a substrate (2) at least active elements (1), connection lines (3) and contact blocks (5), characterized in that : - at least one layer of an active material is deposited on the substrate (2) in a known manner, - active zones (1), which correspond to the active and passive (1') elements corresponding to the connection lines, are delimited, simultaneously with their deposition or afterwards, in the layer of active material, and then - connection lines (3) are realized on the passive zones (1') and the contact blocks in a known manner. |
