| 摘要 |
PURPOSE:To provide a high density high reliability circuit board provided with a hard circuit board on part of a flexible circuit board by effecting, after joining a copper-overlaid plate for formation of the hard circuit board with both surfaces of a flexible circuit board sheet, processing to make conductive a through-hole of a hybrid part and processing of circuit pattern formation on the side of the hard circuit board. CONSTITUTION:Copper-overlaid plates 3, 4 for formation of a hard circuit board, which includes separation means 5 at the boundary between flexible part 7 and a hybrid part 6, are arranged on both surfaces of flexible circuit board sheets 1, 2 which include a desired circuit wiring pattern formed previously, and the copper-overlaid plates 3, 4 are bonded with the sheets 1, 2 with use of an adheive 8 on other region than the flexible part 7. Then, the copper-overlaid plates 3, 4 and the flexible circuit boards 1, 2 are subjected to desired processing to make conductive the through-hole in the hybrid part 6. In succession, a desired circuit pattern is formed on the copper- overlaid plates 3, 4 corresponding to the hybrid part 6. Thereafter, punching is applied along contour lines 6A, 7A of the hybrid part 6 including the separation means 5 and the flexible part 7 to separate a copper-overlaid plate portion located at the flexible part for thereby providing hard circuit boards 3, 4 only on both surfaces of the hybrid part 6. |
