发明名称 |
Method for preparing substrates for subsequent electroless metallization. |
摘要 |
<p>A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer.</p> |
申请公布号 |
EP0298345(A2) |
申请公布日期 |
1989.01.11 |
申请号 |
EP19880110292 |
申请日期 |
1988.06.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CLARKE, THOMAS CARL;KOVAC, CAROLINE ANN;JUNG, DAE YOUNG;PARK, JAE MYUNG;THOMAS, RICHARD RONALD |
分类号 |
C23C16/06;C23C16/04;C23C16/18;C23C18/16;C23C18/20;C23C18/28;C23C18/30;H01L21/288;H05K3/14;H05K3/18 |
主分类号 |
C23C16/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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