| 摘要 |
PURPOSE:To contrive to make the title package smaller in size by a method wherein a solid-state optical sensor of a rear irradiation type of which wiring is performed from the surface through bonding is mounted, where any structural element is not provided between the rear of the solid-state optical sensor and a light emitting body to support the solid-state optical sensor, which is supported by the part adjacent to the photodetecting region of the solid-state optical sensor surface through the intermediary of a bonding agent. CONSTITUTION:A frame-shaped insulator with a hole larger than a solid-state optical sensor at its center, which has a recessed part 5 formed around the central hole 4 and lower than the peripheral part, is provided as a basic component and bonding pads 6 are built on the flat part of the recessed part 5. A main part 1 with conductors 7 which are electrically connected with the bonding pads 6 and extend out of the insulator passing through it and an interim supporting part 2, which is parallel plate- shaped, with vent holes 8 provided at the part which is not covered with the solid-state optical sensor when it is temporarily bonded are provided. Moreover, a base part 3 is provided which is a parallel plate, formed of the same material as the main part 1, and provided with a bonding agent reservior 10 on the central part of its one surface and vent holes 9 formed around the reservior 10. By these processes, miniaturization can be contrived.
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