| 摘要 |
<p>PURPOSE:To prevent the lowering of the reliability of a semiconductor device due to refuse and dust intruding into a package by coating the internal surfaces of a base and a cap for the package with a resin attracting refuse, dust, etc. CONSTITUTION:In a semiconductor device hermetically sealing a semiconductor element chip 3 loaded onto a base 1 for a package by a cap 6, etc., the internal surfaces of the base 1 and the cap 6 are coated with a resin 8 attracting X such as refuse, dust. The semiconductor element chip 3 is bonded with a cavity 2 formed to the top face of the base 1 such as a ceramic base 1, and the semiconductor element chip 3 and a lead frame 4 are electrically connected by bonding wires 5. The base 1 is covered with a ceramics cap 6, and the base 1 and the cap 6 are hermetically sealed with low-melting-point glass 7. The rear of the ceramic cap 6 is coated with the resin 8 at that time, and a resin generating static electricity on the surface after thermosetting is used as the resin 8. A polyimide resin, a silicone resin, etc., are employed.</p> |
