发明名称 PRINTED WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent the exfoliation of a conductive material from a substrate by printing the conductive material which forms a wiring through intermediary materials on a substrate into a required form. CONSTITUTION:A printed wiring board 2 is manufactured by printing a conductive material which forms wiring 6 through intermediary materials 12 on a substrate 4 into a required form. The intermediary materials 12 consist of raw materials where substances having the large strength of bond such as glue, dextrin, milk casein, nitrocellulose, phenol, and the like are mixed in the substances, for example, urethane, acrylic, nylon, epoxy resins and so forth and their resultant adhension is to be improved. These intermediary materials prevent the unfavorable property of the conductive material where shrinkage of material due to heat generated by soldering electric elements 8 develops. This treatment avoids some unfavorable problems such as the exfoliation of the conductive material from the substrate 4.
申请公布号 JPS647591(A) 申请公布日期 1989.01.11
申请号 JP19870161884 申请日期 1987.06.29
申请人 ABISARE:KK 发明人 KASAHARA KEIJI
分类号 H05K3/12;H05K3/38 主分类号 H05K3/12
代理机构 代理人
主权项
地址