| 摘要 |
PURPOSE:To eliminate generation of cracks to obtain a ceramic multilayer interconnection substrate with high density by filling the central part of a through hole with an insulating material. CONSTITUTION:A conductive layer 3 for through hole is formed on the inwall of a through hole 2 of a substrate insulating layer 1. A filling layer 6 of the same component as that of the insulating layer 1 is formed in the through hole 2. And a printed conductive layer 4 is formed on each of both surfaces of the substrate body comprising the insulating layer 1 and the filling layer 6. Then, the ratio which the conductive layer 3 forms is so small that the stress, which results from the difference of the thermal expansion coefficient between the insulating layer 1 and the filling members 3, 6 in the through hole 1 and stresses between upper and lower surfaces of the through hole 2, is reduced. As a result, cracks are prevented from being generating in the portion A. Therefore, a ceramic multilayer interconnection substrate with high density can be obtained. |
