| 摘要 |
PURPOSE:To provide a compact heat pipe which is suitable for cooling an electronic equipment, a semiconductor element, etc., without decreasing a thermal performance in a group wick type heat pipe to be used in a horizontal condition by a method wherein a heat input part of which diameter is reduced (evaporation part ) is arranged. CONSTITUTION:A heat pipe 3 is of a rectangular group wick type 7, and a container is composed of a steel cylinder body and working liquid of pure water is filled into it and installed in a horizontal state. An input part of heat 6 is reduced in its diameter by a swaging work and buried in a steel thermal conducting block 11 through soldering and then a generated heat of a semiconductor element 2 is transmitted to the heat pipe 3 so as to make a compact system. A heat discharging part 4 is provided with plate fins made of aluminum. In this way, the heat input part of the heat pipe is reduced in its diameter to reduce the width of groove; thereby, the capillary action of the heat input part is improved and a compact size can be attained without reducing the thermal performance. |
