| 摘要 |
<p>PURPOSE:To prevent terminals for external connection from deforming as well as to prevent the adjacent terminals for external connection from coming into contact with each other by a method wherein the parts of the adjacent terminals are covered with insulators excepting the external connection parts thereof and moreover, the terminals are formed in an integrally formed structure through the insulators. CONSTITUTION:A package for a semiconductor device is provided with a case 1, interterminal insulators 2, terminals 3 for external connection, bonding wires 4 and a semiconductor chip 5. With the terminals 3 mounted to the case 1 covered with the insulators 2 excepting the point parts thereof, the adjacent terminals 3 are formed in an integrally formed structure. Thereby, the terminals 3 can be prevented from deforming and at the same time, the adjacent terminals 3 can be prevented from coming into contact with each other.</p> |
