PRINTED CIRCUIT ELEMENT COMPRISING A POLYIMIDE- CONTAINING COVER LAYER

摘要

A printed circuit element comprising a polylmidecontaining cover layer The invention relates to a printed circuit element in which the outer conductor layers or the electrical components arranged thereon are provided with a cover layer. The cover layer consists of heat-sealable hightemperature adhesive which is joined to a layer of intractable fully aromatic polyimide. The described circuit elements show very good mechanical, thermal and electrical properties and may be used with advantage inter alia in electronics, in radio and computer technology, in electric motors and in aircraft and aerospace and telecommunications.