TEMPERATURE-MEASUREMENT DEVICE FOR SEMICONDUCTORS, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR MEASURING THE TEMPERATURE OF SEMICONDUCTORS DURING ANNEALING PROCESSES

摘要

PCT No. PCT/DE88/00249 Sec. 371 Date Dec. 1, 1989 Sec. 102(e) Date Dec. 1, 1989 PCT Filed Apr. 27, 1988 PCT Pub. No. WO88/08965 PCT Pub. Date Nov. 17, 1988.The measuring instrument for determining the temperature in the interior of a semiconductor member (1) contains a thermoelement (5) integrated in the semiconductor member. In the manufacture of this measuring instrument, the thermoelement (5) is introduced into a recess (6) of the semiconductor member (1) and the recess (6) is filled out with a material that corresponds to the chemical composition of the environment of the recess (6). The measuring instrument for determining the surface temperature of a semiconductor member contains a thermoelement that is vapor-deposited on the surface of a semiconductor member or contains a thermoelement having a seating weight for placement against the surface of a semiconductor member. In the method for determining the temperature of semiconductor members during tempering processes, it is provided that the measuring instruments determine the temperature of reference semiconductor members. A measuring instrument together with a reference semiconductor member is thereby tempered together with the semiconductor member. The field of employment is the manufacture of semiconductor products.