| 摘要 |
PURPOSE:To enable application of the title sheet to a high-frequency circuit board by improving adhesion between polyolefin superior in dielectric characteristics and a metallic foil, by a method wherein the metallic foil, a polyolefin adhesive film, glass fiber cloth and a polyolefin sheet are superposed upon one another in order, which are integrated through heating and pressurization. CONSTITUTION:A metallic foil 1, a polyolefin adhesive film 2, glass fiber cloth 3 and a polyolefin sheet 4 are superposed upon one another for example, in the order, of the metallic foil 1-polyolefin adhesive film 2-glass fiber cloth 3-polyolefin sheet 4-glass fiber cloth 3-polyolefin adhesive film 2-metallic foil. Then a laminated sheet of about 1.5mm thick is formed by integrating these through heating and pressurizing by a flat plate press. The polyolefin adhesive film 2 is used for making adhesion between the metallic foil 1 and an insulation base material favorable. In this instance, as content of carboxylic acid is 1% or lower and adheres to a metal strongly, bad effect is not given to dielectric characteristics in a high-frequency zone. Then the glass fiber cloth 3 can prevent a warp or a twist to be generated on the laminated sheet due to a difference between thermal expansion coefficients ar specific heat of the metallic foil and insulation base material and a distortion to be generated at the time of molding processing such as heating-cooling processes. |
