| 摘要 |
PURPOSE:To contrive the stabilization of quality of a lead frame by a method wherein, after the lead frame is positioned at the same time as the lead frame is temporarily mounted on a ceramic semiconductor package main body at a temperature a little lower than a temperature, at which a brazing metal is completely fused, silver solder pellets are heated to solder the lead frame on the package main body. CONSTITUTION:A plurality of pieces of terminals 2a are mounted on a lead frame 2, but cylindrical silver solder pellets 3A of a constant size are each mounted on parts of the terminals, which are soldered to a ceramic package main body. This lead frame is set on the main body, is temporarily mounted at a temperature a little lower than a temperature, at which the silver solder is completely fused, and in a degree that the lead frame is not falled out from the main body and at the same time, after the lead frame is positioned correctly, the lead frame is mounted on the package main body by fusing completely the pellets 3A. Thereby, the dispersion in the strength of soldering is reduced and the stabilization of quality of the lead frame can be contrived.
|
