发明名称 INTEGRATED CIRCUIT
摘要 PURPOSE:To make it possible to detect easily which part of which terminal is faulty by a method wherein bonding pads are ready-formed in a plurality of kinds different in shapes from one another. CONSTITUTION:A square pad part 1 is formed as a square standard type pad, is made to correspond to the terminal of P1 of the terminal number 1 of a package, for example, and an increase part 3 is added to the residual part of the biased lead-out part of one side, from which a lead-out conductor wire part 2 is led out, of the square to form a bonding pad in a form changed from the former square. Moreover, in addition to the increase part, a secondary increase part 4 of the size of half of the amount of this increase is added and this bonding pad is made to correspond to the terminals of P10, P20,... of the terminal numbers 10, 20.... The standard type pad is connected to terminals other than the terminals of P1, P10, P20'.... Thereby, as the terminals of the package start with the terminal of P1 and proceed counterclockwise, which pad corresponds to which terminal can be easily known at a glance.
申请公布号 JPS63311730(A) 申请公布日期 1988.12.20
申请号 JP19870147641 申请日期 1987.06.12
申请人 NEC CORP 发明人 UENO TAKAHIDE
分类号 H01L21/60 主分类号 H01L21/60
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