| 摘要 |
PURPOSE:To uniformly stretch individual wafer chips bonded to an adhesive agent layer of an adhesive sheet in a face direction in order to separate the chips from one another at nearly equal intervals and to make a subsequent picking-up operation easy by a method wherein the rear of a substrate material formed on the surface of the adhesive agent layer is roughened. CONSTITUTION:When an expanding operation is executed after a semiconductor wafer A bonded to an adhesive agent layer 12 in an adhesive sheet 10 has been diced, a pressure jig 5 is pressed to the rear of a substrate material 11 in the adhesive sheet 10, Because the rear of the substrate material 11 is roughened, the pressure jig 5 is brought into contact with the rear of the roughened substrate material 11 in a point-contact manner; the friction is reduced sharply as compared with a conventional method; the substrate material 11 in the adhesive sheet 10 glides suitably on the surface of the pressure jig. By this setup, the adhesive sheet 10 is stretched uniformly; individual wafer chips A1-A5 bonded to the adhesive agent layer 12 in the adhesive agent 10 are separated from one another at nearly equal intervals; a subsequent picking-up process can be executed easily. |
