发明名称 LEAD MATERIAL FOR PACKAGE FOR ELECTRONIC EQUIPMENT
摘要 PURPOSE:To improve the electroconductivity, heat radiability, heat resistance, strength solderability and plating characteristics of the titled lead material by incorporating specific amounts of Ni, Si and V thereto and regulating each content of O2, H2 and S. CONSTITUTION:The lead material contg. by weight, 0.1-4.5% Ni, 0.05-1.2% Si and 0.005-0.2% V, in which <=200ppm O2 content, <=10ppm H2 content and <=20ppm S content are regulated and consisting of the balance Cu with inevitable impurities is prepd. <=5.0% Zn and/or total <=0.5% of one or more kinds among <=0.3% Ca, Mg, misch metals, P, Cr, Zr, B, Y, La, Fe and Co are furthermore added thereto at need. By this method, the lead material having drastically excellent electroconductivity and heat radiability and having excellent heat resistance, strength, solderability and plating characteristics equal to Fe-42% Ni alloy can be obtd. Said material is therefore suitable as the lead material for a ceramic package in an electronic equipment.
申请公布号 JPS63310933(A) 申请公布日期 1988.12.19
申请号 JP19870146500 申请日期 1987.06.12
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 ASAI MASATO;TERASHITA MICHIAKI;OYAMA YOSHIMASA;SHIGA SHOJI
分类号 C22C9/00;C22C9/06;H01B1/02;H01L23/50;H01R13/03 主分类号 C22C9/00
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