| 摘要 |
<p>A copper etching composition and an improved method for copper etching utilizing the composition, the composition includes an aqueous solution of a strong acid, a stabilized hydrogen peroxide, and an accelerator that can include both a triazole compound and either an aliphatic water soluble monoalcohol or a glycol monoether in the etchant solution to provide a faster etching rate.</p> |
