发明名称 SOLID-STATE IMAGE SENSING DEVICE
摘要 PURPOSE:To reduce the noise of fixed pattern and to contrive improvement in the quality of picture by a method wherein a shield member, having light- transmitting property and conductivity, is provided between an optical low frequency filter and a solid-state image sensing element chip. CONSTITUTION:A shield member 11 is provided on the surface of the infrared ray filter 10 located between a solid-state image chip 1 and an optical low frequency filter 9, and the shield member 11 is composed of the transparent conductive having optical transmitting property to pass through an optical signal. To be concrete, the shield member 11 is formed using a transparent conductive material ITO which is the mixture of In2O3 and ZnO2 for example. Said transparent conductive material ITO is formed by sputtering. Accordingly, the clock signal sent from the solid-state image-sensor chip 1 through a transparent glass cap 3 and going into the optical low frequency filter 9 is absorbed by the shield member 11, and an electromagnetically shielding can be obtained so that the clock signal does not reach the filter 9. As a result, the noise of the fixed pattern of the solid-state image sensor chip can be reduced, and the quality of picture can also be improved.
申请公布号 JPS63308375(A) 申请公布日期 1988.12.15
申请号 JP19870144916 申请日期 1987.06.10
申请人 HITACHI LTD;HITACHI DEVICE ENG CO LTD 发明人 MIYAZAWA TOSHIO;YASUDA KOZO;SOKEI HIROICHI;TAKEMOTO KAYAO
分类号 G02B27/46;H01L27/14;H01L27/146;H04N5/225;H04N5/335;H04N5/341;H04N5/365;H04N5/369 主分类号 G02B27/46
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