| 摘要 |
<p>PURPOSE:To make a chip small in area by a method wherein a through hole section is provided just under the electrode of a semiconductor integrated circuit device which is provided with the externally connecting electrode built on the semiconductor chip and an internal wiring to be electrically connected with the electrode through the intermediary of the through hole section. CONSTITUTION:A semiconductor integrated circuit device is provided with an externally connecting electrode 12 on a semiconductor chip and an internal wiring 22 to be electrically connected with the electrode 12 through the intermediary of a through hole section 13, where the through hole section 13 is formed just under the electrode 12. For instance, the through hole section 13 is provided just under a PAD consisting of the second aluminum 12 and connected with a first aluminum 11 thereunder. Therefore, the PAD can be provided close to the internal wiring 22 so as to enable the chip to be smaller in area.</p> |
