| 摘要 |
PURPOSE:To reduce the occurrence of defects by causing the bonding surface side to become a burr side in the end of the inner lead and causing the upper surface to become a sag side. CONSTITUTION:The cross-sectional shape is different in the outside and inside of a tiebar 13 with a lince C as a boundary, and in the end part of an inner lead 12, a sag side (d) is positioned in the underside and in the upper surface, a deburring side (d) is planarized by coining. On the other hand, in an outer lead part 14, it is constructed so that the upper surface becomes the sag side (d) and the underside becomes the deburring side (b). With this, a sufficient effective plane width can be obtained without affecting the lead spacing and, even in bending the outer lead, a highly reliable semiconductor device can be formed without producing a metallic powder.
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