发明名称 DEVICE FOR DEFORMING SUBSTRATE FOR PRINTED WIRING BOARD
摘要 PURPOSE:To obviate inclusion of air bubbles in the surfaces, etc., of substrate which are held immersed in a treating liquid and to produce high-performance printed wiring boards without generating product defects by oscillating a rack or rack hanger by means of an oscillation imparting device, thereby oscillating the substrates held to the rack. CONSTITUTION:The rack 2 which holds the substrates 1 for printed wiring perpendicularly by means of a lower holding part 5 and an upper retaining part 6 thereof is successively lowered into a treating cell and the substrates are successively treated by the treating liquid in said cell. The rack or rack 2 hanger 11 is oscillated by the oscillation imparting device 8 disposed to the rack 2 or hanger 11 side to oscillate the substrates 1, which the air bubbles included into the substrates at the time of immersing the same into the treating liquid are removed from the substrates 1. The direction where the oscillation is applied by the above-mentioned 8 is orthogonal with the substrates 1 and the device 8 consists of an oscillation generator 81 and a hammer 82 driven back and forth by this generator 18. The hammer 8 is preferably disposed to face the rack 2 or the hanger 11.
申请公布号 JPS63307299(A) 申请公布日期 1988.12.14
申请号 JP19870141143 申请日期 1987.06.05
申请人 UBE IND LTD;MEIKO DENSHI KOGYO KK 发明人 YASUNO HIROSHI;SAKATANI SHIRO;KANDA TAKESHI
分类号 C25D13/00;C25D13/22;H05K3/00;H05K3/06 主分类号 C25D13/00
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