发明名称 CHAMFERING METHOD FOR PRINTED SUBSTRATE
摘要 PURPOSE:To enable each corner part of printed substrates to be continuously and automatically further simultaneously chamfered by discharging the printed substrate to be loaded after its surface peripheral edge part is chamfered in a condition that all the unfinished printed substrates in plural stages during conveyance are deformed into an almost lozenge shape. CONSTITUTION:Unfinished printed substrates 4a, piled to be mounted in plural or multiple stages, are conveyed being supplied to a chamfering part 5 from a shearing machine 2 through a supply conveying part. This printed substrate 4a during conveyance, is deformed all into an almost diamond shape by a diamond deforming device in the first-fourth chamfering mechanism parts in this chamfering part 5. Unfinished corner parts of these printed substrates 4a, while they hold this diamond shape by a shifter, are successively and continuously chamfered by a chamfering tool part in each chamfering mechanism part. In this way, discharging a printed substrate 4b, chamfering all the corner parts, to be conveyed to a loading part 7 from the chamfering part 5 by a discharge conveying part 6, these substrates 4b are stacked being mounted in this loading part 7.
申请公布号 JPS63306866(A) 申请公布日期 1988.12.14
申请号 JP19880136577 申请日期 1988.06.02
申请人 CMK CORP 发明人 OTANI YASUAKI;KUBO ISAMU
分类号 B24B9/00;H05K3/00 主分类号 B24B9/00
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