| 摘要 |
PURPOSE:To provide a resin composition which is low in dielectric constant and excellent in electrical properties and heat resistance, and does not generate a volatile by-product when molded, comprising as essential component a specific compound of a structure having a maleimide group and an increased number of CF3 groups. CONSTITUTION:A compound of formula I (wherein R1 is a divalent organic group which has one or more aromatic rings of formulae II-VIII, etc.) which has a structure having a maleimide group and an increased number of CF3 groups, as essential component, is polymerized to produce a thermoplastic resin. This resin is, if desired, blended with a bismaleimide which is a polyfunctional compound as a crosslinking component to prepare a thermosetting resin composition, which is molded into a desired shape and cured to obtain a thermosetting molded product.
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