| 摘要 |
PURPOSE:To form a bump having a complete shape at the tip part of a finger, and obtain a sure direct junction between the bump and a semiconductor ele ment, by making the width of the finger tip part for forming the bump differ from the other parts of the finger. CONSTITUTION:In a circuit substrate wherein a bump 2 is formed at a finger 1 tip part, the width of the finger 1 tip part is made different from the other of the finger 1. That is, the bump 2 is directly bonded with a pad part of the finger 1 semiconductor element, and the tip part of the finger 1 is made wide. Therefore, the bump 2 having a complete shape can be formed on the finger 1, even if position deviation between the bump 2 and the finger 1 generates at the time of patterning. The sure junction between the bump 2 and the pad part of an semiconductor element is enabled, thereby.
|
