发明名称 INSPECTING DEVICE FOR PACKING OF CHIP PARTS
摘要 PURPOSE:To execute a packing inspection without being influenced by a variance of a character and a pattern on the surface of chip parts, by checking a correlation of a reference image formed by averaging a value of an image pickup signal of chip parts which become a reference. CONSTITUTION:Based on an image pickup signal of a non-defective chip which becomes a reference, its image pickup signal is averaged, and a reference image is formed and stored in advance in a reference image memory 5. Subsequently, a base plate 2 to be inspected is installed to a base plate, and chip parts 1 are brought to an image pickup by a television camera 3. This image pickup image is digitized, and stored in an image memory 4. next, a correlation value of an image value stored in the image memory 4 and an image value stored in the reference image memory 5 is derived by a correlation arithmetic means 6. Based on its correlation value, a packing state of the chip parts is decided by a deciding means 7.
申请公布号 JPS63304109(A) 申请公布日期 1988.12.12
申请号 JP19870139439 申请日期 1987.06.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIROOKA MIWAKO;KAWATO SHINJIRO
分类号 G01B11/24 主分类号 G01B11/24
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