| 摘要 |
PURPOSE:To cool memory-related semiconductor devices by a water cooling system and to shorten a mounting pitch of packages by a method wherein heat-conducting plates are installed around the semiconductor devices acting as heat-generating bodies, the devices are shut up and the heat is conducted to a cooling pipe forming a coolant flow path on the packages via an atmosphere. CONSTITUTION:SIP-type long-sheet-like multilayer ceramic packages (MCP's) 7 where semiconductor devices 8 are mounted on one face are arranged on a printed-circuit board 1. One each long-sheet-like heat-conducting plate 3 is arranged between two long-sheet-like MCP's 7; their upper space is covered with flat-sheet-like heat-conducting plates 4. Cooling pipes 2 such as copper pipes or the like are installed in such a way that they cross at a right angle to a longitudinal direction of the long-sheet-like MCP's 7. The heat generated by the semiconductor devices 8 is dissipated from the surface of the long-sheet-like MCP's 7 whose heat capacity is large; the heat reaches a coolant such as water or the like in the sequence of an ambient atmosphere, the long-sheet-like heat-conducting plates, the flat-sheet-like heat- conducting plates 4 and the cooling pipe 2; the heat is then dissipated to the outside of a package. If the long-sheet-like MCP's 7 and the long-sheet-like heat-conducting plates 3 are retained by keeping an angle theta with reference to the printed-circuit board 1, a height of the package can be suppressed to be lower; accordingly, it is possible to make a mounting pitch of the packages shorter. |
