| 摘要 |
PURPOSE:To provide a thermal head having excellent environmental resistance by forming the first conductor of wirings between an IC and an external signal of gold, then printing and baking an insulating layer, then forming the second conductor of a thick silver film, and soldering a flexible printed board having narrower width than the width of a connector. CONSTITUTION:This thermal head is formed of a heat sink 1, an insulating substrate 2, a heat generating resistor group 3, an IC driver 4, first gold conductors 5, 6, a second silver conductor 7, a soldered section 8, a connector 9, an insulating layer 10 and a cover 11. In case of assembling, the connector is inserted into the electrode section of the substrate 1, and soldered. Then, the cover 11 is clamped to the sink 1. This method has approx. 1/3 of the number of outputs of terminals from the substrate 2 as compared with that of a conventional method and much higher reliability than that of a press-contact connection. This is because the wiring conducted on an FPC is executed on the substrate 2 all through the steps of printing and baking ceramics, i.e., the conductor 6 is electrically connected through the layer 10 to the conductor 2 via a through hole.
|
