发明名称 METHOD AND DEVICE FOR PLATING THROUGH-HOLE OF PRINTED CIRCUIT BOARD
摘要 PURPOSE:To enable plating of a through-hole to be improved by obviating the defects to occur caused by this process by a method wherein the cleanness of the facilities concerned is maintained, while the solutions containing many kinds of electrolytic ions are prevented from mixing with each other. CONSTITUTION:When an automatic travelling device 2, which transfers a printed circuit board, approaches a sensor 6 attached to a transferring rail 4, the sensor 6 is actuated so as to open a magnetic valve 9 provided midway on a tap water piping 10 for a rinsing vessel 8 so that tap water is spouted out from spray nozzles 11 and tap water pipes 10 provided above baffle plates 12. Next, the automatic travelling device 2 receiving signals from a control panel pulls down the printed circuit board 1 into the rinsing vessel 8 so as to rinse the substrate 1 with the sprayed water. During rinsing the substrate 1, water, sprayed up, hits against the baffle plates 12 and then drops down into the rising vessel 8, therefore dirty water is prevented from mixing with the solution containing electrolytic ions in an adjacent plating tank. By these processes, a plating film formed on the wall of a through-hole can be prevented from producing defects.
申请公布号 JPS63296392(A) 申请公布日期 1988.12.02
申请号 JP19870132707 申请日期 1987.05.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAKURA YOSHINORI
分类号 C23C18/16;C23C18/31;C25D7/00;H05K3/42 主分类号 C23C18/16
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