| 摘要 |
<p>PURPOSE:To prevent X-ray absorbers from peeling-off or damaging during the manufacturing processes by a method wherein throughholes are made in an organic substance layer and then the manufacturing processes to follow are performed with these throughholes filled with X-ray absorbers. CONSTITUTION:A conducting layer 33 and an inorganic substance layer 35 in high X-ray transmissivity and transparent to a visible light are formed on a silicon substrate 31 to be a primer layer 31 and then throughholes 39 reaching the surface of the conducting layer 33 are made in the inorganic substance layer 35. First, after forming Au layers 41 to be X-ray absorbers by plating process in the throughholes 39, a reinforcement layer 43 is formed on the surface of the inorganic substance layer 35 including the Au layers 41. Second, the central part excluding the peripheral parts of the primer layer 31 and the conducting layer 33 is removed to make said peripheral parts supporting frames 31a. Through these procedures, the X-ray absorbers 41 (Au layers 41) as they are constantly buried in the layer 35 can pass through the manufacturing processes so that the X-ray absorbers 41 may be prevented from peeling-off, damaging and inclining during the manufacturing processes, thereby enabling a high quality mask to be manufactured.</p> |
