| 摘要 |
PURPOSE:To prevent surface mounting components from deviating at the time of mounting by forming a section which does not become a pad at least at one position of a wiring board to support one terminal by a plurality of points, lines or faces. CONSTITUTION:Wiring copper foil patterns 8, 9 are formed on an insulating substrate 7 on a wiring board 20, and pads 12 each having special shape are provided at positions where the terminals 11 of surface mounting components 10 to be mounted thereon. That is, each pad 12 is formed with a cavity 13 at the center to form a section which does not become the pad 12. When the component 10 is attached on the wiring board 20 to be mounted by soldering on such a wiring board 20, the component 10 is placed on the pad 12 of the wiring board 20, and the terminal 11 is placed on a predetermined position. In this case, since one terminal 11 is supported stably by the two or more soldered pads 12, it is not moved. Then, the component 10-disposed substrate is disposed in a solder melting environment to connect the terminal 11 of the component 10 to the pads 12 by soldering.
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