发明名称 FORMATION OF THICK-FILM CIRCUIT
摘要 PURPOSE:To improve the productivity and breakdown strength by a method wherein, after a dielectric paste is discharged and formed on a conductor where a thick-film conductor pattern is formed in advance, a conductor paste is coated on a dielectric in such a way that this paste crosses the conductor. CONSTITUTION:A paste 2 whose air bubbles have been removed in advance is filled in a nozzle 1; a pressure is exerted on the dielectric paste 2 from a nozzle discharge opening 6; the nozzle 1 is actuated by an NC data while an interval between a substrate 3 and the nozzle discharge opening 6 is kept constant; the dielectric paste 2 is discharged and formed; after that, an upper-part conductor 5 is formed in the same manner while the upper-part conductor 5 crosses a lower-part conductor 4. Accordingly, a pinhole at a dielectric and a disconnection at a stepped part of the substrate 3 and the dielectric are not caused. If, when an upper-part conductor paste is discharged, a drawing speed on the substrate 3 and on the dielectric is made slower than the drawing speed at a drawing operation of the stepped part, the disconnection of the upper-part conductor 5 at the stepped part is prevented. By this setup, the productivity and breakdown strength are improved.
申请公布号 JPS63289895(A) 申请公布日期 1988.11.28
申请号 JP19870124206 申请日期 1987.05.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAEKI KEIJI;NAKATSUJI HACHIROU;KABESHITA AKIRA
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址