| 摘要 |
PURPOSE:To reduce the extent of contact resistance by performing the diffusion treatment of Cu and Ni after this Ni is coated on a substratum of the Cu. CONSTITUTION:A contact 12 of a permalloy 11 is formed as a total ratio solid solution by heat treatment for 15 minutes at a temperature of 900 deg.C after stacking an Ni plating layer on a substratum layer 13 of Cu where Fe is hard to do its thermal diffussion. Consequently, an Fe component to be contained in this permalloy 11 is almostnot thermally diffused to an electric contact, thus Fe is in no case made to appear on a surface of the contact 12. In consequence, contact resistance in the contact 12 is small, and it is stable against operating frequency. Accordingly, performance of electric parts including a reed switch or the like is thus improvable. |
