| 摘要 |
PURPOSE:To build a solder bump direct on an electrode formed on a substrate without providing an under metal so as to simplify a process by a method wherein a bump containing one or more kinds of metal chosen from Pd, Pt, and Au is provided on an electrode through the intermediary of a bonding layer consisting of one or more kinds of metal chosen from Pd, Pt, and Au, and Al. CONSTITUTION:An electrode 33 of Al or Al alloy exposed from an insulating film 34 coating a substrate 31, and bump 35 containing, at least, one kind of metal chosen from Pd, Pt, and Au which is provided through the intermediary of a bonding layer 36 consisting of, at least, one kind of metal chosen from Pd, Pt, and Au, and Al are provided. And, melting solder 23 containing, at least, one kind of metal chosen from Pd, Pt, and Au is rendered to be touched with the surface of the electrode 33 of Al or Al alloy, and thereafter ultrasonic is applied to the melting solder so as to adhere a solder 35 through alloying the melting solder 23 with the surface of the electrode 33 for the formation of a substrate with a solder bump. For instance, a substrate 11 is dipped into the melting solder 23 in a soldering vessel and an ultrasonic vibrator 25 is inserted so as to apply ultrasonic onto the melting solder 23.
|
