| 摘要 |
<p>PURPOSE:To exactly hold a base plate at the time of die-bonding and wire- bonding by forming the most part of the bottom surface of the base plate as flat surface. CONSTITUTION:The titled pickup device 20 consist of a single-phase drive solid- state image pickup element chip 21 mounted on the base plate 22. In the base plate 22, plural external leads 23 made of metal are provided by means of imbedding at the time of forming. A die attachment 24 made of metal is provided between the chip 21 and the base plate 22. The die attachment 24 extends on the side surface of the base plate 22, and connects with a metallized rear surface on the base plate bottom surface 25, and furthermore connects with one of the external leads 23. The flat surface part which occupies the most part of the base plate bottom surface and is the trace of a main extrusion pin at the time of forming and fine burrs around the external edge thereof exist at the bottom surface 25 of the base plate.</p> |
